Vladimir Polezhaev

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Engineering Precision for Next-Generation Power Electronics.

Specialist in power semiconductor embedding, advanced fabrication processes, and high-performance current sensor development. With nearly a decade of engineering experience, he combines technical depth with a strong focus on quality, efficiency, and manufacturing excellence.

About

With close to ten years of hands-on experience in the field of power semiconductor embedding, I am dedicated to pushing the boundaries of modern power electronics. My work spans the complete process chain—from fabrication technologies and process optimization to the development of high-accuracy current sensors for demanding applications.

Driven by a passion for precision and technological innovation, I strive to create solutions that enhance the performance, reliability, and manufacturability of next-generation power electronics.

In my current role within a high-tech startup, I am responsible for:

• Quality assurance
• Process optimization
• Evaluation of fabrication workflows
• Implementation of robust engineering standards
• Continuous improvement strategies in semiconductor processing

My mission: to build the technical foundations that enable efficient, scalable, and future-ready power electronic systems.

Knowledge

Power Semiconductor Embedding

• Development and optimization of embedding technologies
• Material selection and interface engineering
• Reliability-driven process design

Fabrication Process Development

• End-to-end fabrication workflows
• Process stabilization & repeatability
• Identification and elimination of bottlenecks

Quality Assurance in Power Electronics

• Inspection strategies & defect analysis
• Root cause analysis and corrective actions
• Statistical process control (SPC)

High-Performance Current Sensor Development

• Sensor architecture & layout concepts
• Optimization for accuracy, bandwidth, and thermal stability
• Integration into advanced power electronic systems

Continuous Improvement & Industrialization

• Lean process strategies
• Scalability planning for manufacturing
• Cross-functional engineering collaboration

Professional Experience

Scientific Assistant
University of Applied Sciences Kempten · Full-time
Nov 2017 – Oct 2025 · 8 years

• PCB design and fabrication
• Semiconductor embedding and characterization (Si, SiC, GaN)
• Development and testing of power electronic modules
• Support for research and laboratory activities in electronics integration

Test Engineer
NAVIgard · Full-time
Apr 2016 – Sept 2016 · 6 months

• Testing and evaluation of security and access control systems
• Functional verification of CCTV and electronic security components
• Performance analysis and troubleshooting within R&D workflows

Education

Master of Engineering (MEng), Electrical Engineering
University of Applied Sciences Kempten
Oct 2016 – July 2018

• Final grade: 1.9
• Activities: Electronics Integration Laboratory (EI-Lab), International Club

Certificate of Exchange Studies – Engineering Physics / Applied Physics
University of Łódź
Oct 2015 – Feb 2016

• GPA: 92%
• Activities: International Club
• Coursework included: Nanoelectronics, Microprocessors Systems, Modern Physics Methods, Semiconductor Fundamentals, Experimental Techniques

Team

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